Tokyo Electron 2L39-000065-31發(fā)電機(jī) PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Tokyo Electron 2L39-000065-31 發(fā)電機(jī) — 產(chǎn)品應(yīng)用領(lǐng)域詳解
1. 射頻/等離子體電源系統(tǒng)中的功率源
核心功能：2L39-000065-31 發(fā)電機(jī)可能作為等離子體源的射頻（RF）發(fā)電模塊，為刻蝕或CVD等等離子工藝提供高頻電能。
適用工藝：如反應(yīng)離子刻蝕（RIE）、感應(yīng)耦合等離子體（ICP）、等離子清洗、PECVD 等半導(dǎo)體制造環(huán)節(jié)。
工藝優(yōu)勢(shì)：穩(wěn)定輸出射頻功率，確保等離子體穩(wěn)定激發(fā)，提高工藝重復(fù)性與制程控制精度。
2. 半導(dǎo)體設(shè)備中專用電能轉(zhuǎn)換模塊
電源角色：作為內(nèi)部發(fā)電組件，為特定工藝模塊提供定制化的電壓/頻率轉(zhuǎn)換。
多種形式：可為 DC、RF 或中頻（MF）等不同頻率范圍的發(fā)電用途，配合匹配器、整流器等模塊一同工作。
接口應(yīng)用：通常與射頻匹配網(wǎng)絡(luò)、溫控模塊、電極或反應(yīng)腔集成使用。
3. 設(shè)備自主能量供應(yīng)與過程穩(wěn)定保障
系統(tǒng)獨(dú)立性：通過內(nèi)建發(fā)電模塊可減少對(duì)外部電網(wǎng)波動(dòng)的依賴，提升整機(jī)抗干擾能力。
動(dòng)態(tài)響應(yīng)：支持快速啟動(dòng)與功率調(diào)整，滿足不同階段制程需求。
4. 應(yīng)用設(shè)備范圍
典型配套設(shè)備：
干法刻蝕機(jī)（Etcher）
PECVD 設(shè)備
等離子清洗系統(tǒng)
表面改質(zhì)/蝕刻設(shè)備等
主要行業(yè)：
半導(dǎo)體晶圓制造
微機(jī)電系統(tǒng)（MEMS）
光電元件與顯示器件加工
英文資料：
Tokyo Electron 2L39-000065-31 Generator - Detailed Explanation of Product Application Fields
1. Power source in RF/plasma power supply system
Core function: 2L39-000065-31 generator may serve as a radio frequency (RF) power generation module for plasma sources, providing high-frequency electrical energy for plasma processes such as etching or CVD.
Applicable processes: such as reactive ion etching (RIE), inductively coupled plasma (ICP), plasma cleaning, PECVD and other semiconductor manufacturing processes.
Process advantages: Stable output RF power, ensuring stable plasma excitation, improving process repeatability and process control accuracy.
2. Specialized electrical energy conversion module for semiconductor equipment
Power role: As an internal power generation component, it provides customized voltage/frequency conversion for specific process modules.
Multiple forms: It can be used for power generation in different frequency ranges such as DC, RF, or intermediate frequency (MF), and works together with matching devices, rectifiers, and other modules.
Interface application: usually integrated with RF matching networks, temperature control modules, electrodes, or reaction chambers.
3. Equipment autonomous energy supply and process stability guarantee
System independence: The built-in power generation module can reduce dependence on external power grid fluctuations and enhance the overall anti-interference ability of the machine.
Dynamic response: supports fast start-up and power adjustment to meet the requirements of different stages of the process.
4. Scope of application devices
Typical supporting equipment:
Dry Etcher
PECVD equipment
Plasma cleaning system
Surface modification/etching equipment, etc
Main industries:
Semiconductor wafer manufacturing
Micro Electro Mechanical Systems (MEMS)
Processing of optoelectronic components and display devices
2.產(chǎn) 品 展 示
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| 469-P5-LO-A20-T | SS2000D3I | IC3600TLFC1A |
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