Tokyo Electron 3M81-019772-11控制器模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
Tokyo Electron (TEL) 3M81-019772-11 控制器模塊 — 產(chǎn)品應(yīng)用領(lǐng)域詳解
一、產(chǎn)品功能定位
3M81-019772-11 控制器模塊是 Tokyo Electron 半導(dǎo)體設(shè)備中的核心控制單元,負(fù)責(zé)設(shè)備的邏輯控制、數(shù)據(jù)處理及協(xié)調(diào)各子系統(tǒng)的運(yùn)行。該模塊作為控制系統(tǒng)的大腦,執(zhí)行程序指令,處理傳感器數(shù)據(jù),輸出控制信號,保障設(shè)備自動化和精確運(yùn)行。
二、主要應(yīng)用領(lǐng)域
1. 半導(dǎo)體制造設(shè)備主控制系統(tǒng)
典型設(shè)備:
等離子刻蝕機(jī)(Etcher)
化學(xué)氣相沉積設(shè)備(CVD)
薄膜沉積系統(tǒng)(ALD、PVD)
晶圓清洗及顯影設(shè)備
功能職責(zé):
實(shí)時(shí)控制工藝參數(shù)(溫度、壓力、氣體流量、功率等);
管理設(shè)備狀態(tài),協(xié)調(diào)各控制單元、傳感器、執(zhí)行機(jī)構(gòu)的工作;
運(yùn)行工藝程序,保障工藝流程穩(wěn)定、可重復(fù)。
2. 設(shè)備自動化與閉環(huán)控制核心
數(shù)據(jù)采集與反饋處理:采集各類模擬和數(shù)字信號,進(jìn)行數(shù)據(jù)分析與反饋調(diào)整,實(shí)現(xiàn)閉環(huán)控制。
與子模塊協(xié)作:協(xié)調(diào)射頻模塊、電源模塊、真空系統(tǒng)、溫控系統(tǒng)等,實(shí)現(xiàn)整體設(shè)備同步。
異常檢測與安全保護(hù):監(jiān)控設(shè)備運(yùn)行異常,觸發(fā)報(bào)警及保護(hù)動作,保障設(shè)備安全。
英文資料:
Tokyo Electron (TEL) 3M81-019772-11 Controller Module - Product Application Field Detailed Explanation
1、 Product functional positioning
The 3M81-019772-11 controller module is the core control unit in Tokyo Electron semiconductor equipment, responsible for logical control, data processing, and coordinating the operation of various subsystems of the equipment. This module serves as the brain of the control system, executing program instructions, processing sensor data, outputting control signals, and ensuring equipment automation and precise operation.
2、 Main application areas
1. Main control system for semiconductor manufacturing equipment
Typical equipment:
Plasma Etcher
Chemical Vapor Deposition Equipment (CVD)
Thin film deposition systems (ALD, PVD)
Wafer cleaning and developing equipment
Functional responsibilities:
Real time control of process parameters (temperature, pressure, gas flow rate, power, etc.);
Manage equipment status, coordinate the work of various control units, sensors, and actuators;
Run the process program to ensure the stability and repeatability of the process flow.
2. Equipment automation and closed-loop control core
Data collection and feedback processing: Collect various analog and digital signals, perform data analysis and feedback adjustment, and achieve closed-loop control.
Collaboration with sub modules: Coordinate RF modules, power modules, vacuum systems, temperature control systems, etc. to achieve overall equipment synchronization.
Abnormal detection and security protection: Monitor equipment for abnormal operation, trigger alarms and protective actions to ensure equipment safety.
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
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ASEA 57360001-HG Circuit Board
339-E-P5-G5-L-E-S-N-N-SN-N-N | 3050-PIF-3 | IC3600VANA1D |
339-E-P5-G5-H-R-S-N-N-1E-D-N | 3050-EGW2 | IC3600VANA1 |
339-E-P5-G5-H-E-S-N-N-SN-D-N | 3050-EGW1 | IC3600TSUJ1B |
339-E-P5-G5-H-E-S-N-N-1E-D-H | 8010-SSK-374 | IC3600TSUJ1A |
339-E-P1-G1-H-E-S-N-P-3E-D-N | 8010-SPR-300 | IC3600TSUJ1 |
339-E-P1-G1-H-E-S-N-P-1E-D-N | 8010-SPR-250 | IC3600TSUD1B |
339-E-P1-G1-H-E-S-N-N-SN-D-N | 8010-SPR-200 | IC3600TSUD1 |
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