Tokyo Electron E249-000001-11觸感掃描儀 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Tokyo Electron (TEL) E249-000001-11 觸感掃描儀 — 產(chǎn)品應(yīng)用領(lǐng)域詳解
一、產(chǎn)品功能定位
E249-000001-11 觸感掃描儀 是一款集成于 TEL 半導(dǎo)體設(shè)備系統(tǒng)中的高精度表面掃描與接觸感應(yīng)裝置，通常用于檢測晶圓或材料表面的物理狀態(tài)，如形貌偏差、位置校準(zhǔn)、翹曲、接觸壓力等。該模塊結(jié)合機(jī)械臂或掃描平臺，用于工藝前后或裝載過程中對目標(biāo)表面進(jìn)行掃描檢測或觸感反饋采集。
二、主要應(yīng)用領(lǐng)域
1. 晶圓裝載與位置對準(zhǔn)
應(yīng)用設(shè)備：
晶圓搬運(yùn)單元（Load Port）
自動化對準(zhǔn)系統(tǒng)（Aligner）
Transfer Arm 系統(tǒng)中的檢測子模塊
功能說明：
在晶圓加載過程中，觸感掃描儀檢測晶圓是否正確放置在對準(zhǔn)臺或卡盤上；
判斷是否存在偏移、翻轉(zhuǎn)、錯位、缺片等問題；
與視覺系統(tǒng)協(xié)作，提高搬運(yùn)精度與設(shè)備運(yùn)行安全性。
2. 表面翹曲與平整度掃描檢測
檢測內(nèi)容：
晶圓或玻璃基板的局部翹曲程度；
表面彎曲或邊緣起伏；
可聯(lián)動壓力感應(yīng)反饋進(jìn)行物理測量（如微接觸高度差）；
應(yīng)用場景：
在 ALD、PVD、CMP、Etch 等工藝前確認(rèn)表面平整度是否在可控范圍內(nèi)，避免后續(xù)工藝失敗。
英文資料：
Tokyo Electron (TEL) E249-000001-11 Touch Scanner - Detailed Explanation of Product Application Fields
1、 Product functional positioning
E249-000001-11 tactile scanner is a high-precision surface scanning and contact sensing device integrated into TEL semiconductor equipment systems. It is commonly used to detect the physical state of wafer or material surfaces, such as morphology deviation, position calibration, warping, contact pressure, etc. This module, combined with a robotic arm or scanning platform, is used for scanning and detecting the target surface or collecting tactile feedback before and after the process or during the loading process.
2、 Main application areas
1. Wafer loading and positioning alignment
Application devices:
Wafer handling unit (load port)
Automated Alignment System (Aligner)
Detection submodule in Transfer Arm system
Function Description:
During the wafer loading process, the tactile scanner checks whether the wafer is correctly placed on the alignment table or chuck;
Determine whether there are issues such as offset, flip, misalignment, or missing pieces;
Collaborate with the visual system to improve handling accuracy and equipment operational safety.
2. Surface warping and flatness scanning detection
Testing content:
The degree of local warping of wafers or glass substrates;
Surface curvature or edge undulation;
Can be linked with pressure sensing feedback for physical measurement (such as micro contact height difference);
Application scenarios:
Confirm whether the surface flatness is within a controllable range before ALD, PVD, CMP, Etch and other processes to avoid subsequent process failures.
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
ABB PL810P?3BDH000311R0101 電源鏈接模塊
4.其他英文產(chǎn)品
Siemens 6ES7291-8GC00-0XA0 cartridge
Kollmorgen MMC-SD-0.5-230-D servo drive
| 269PLUS-W-100P-120 | 8010-SFI-534 | 0053946-000 |
| 269PLUS-DO-315-100P-HI | 8010-SFI-533 | IC3600TFMA1 |
| 269PLUS-DO-311-100P-HI | 8010-SFI-510 | IC3600TFCU1D1C |
| 269PLUS-DO-271-100P-120 | 8010-SFI-324 | IC3600TFCU1C1B |
| 269PLUS-DO-225-100P-HI-125VDC | 8010-SFI-323 | IC3600TGDD1 |
| 269PLUS-DO-212-10C-120 | 8010-AXS-308 | IC3600TFCA1 |
| 269PLUS-DO-211-120N-120VAC | 8010-AXS-211 | IC3600TDUA1 |
本篇文章出自瑞昌明盛自動化設(shè)備有限公司官網(wǎng)，轉(zhuǎn)載請附上此鏈接:http://www.jiangxidcs
