Tokyo Electron 3D80-000214-V4控制器模塊 PDF資料
1.產 品 資 料 介 紹：
中文資料：
Tokyo Electron 3D80-000214-V4 控制器模塊 是一款專用于半導體制造設備中的智能控制部件，主要用于實現(xiàn)設備內部工藝流程、子系統(tǒng)管理與精密參數(shù)調控功能。該模塊是 TEL（Tokyo Electron）高端設備平臺（如蝕刻、沉積等系統(tǒng)）中的核心控制單元之一。
一、產品功能定位
模塊類型：工藝控制器 / 系統(tǒng)控制器
功能特性：
管理設備運行邏輯、控制指令及狀態(tài)監(jiān)控；
與設備主控系統(tǒng)進行實時數(shù)據(jù)交互；
控制子系統(tǒng)如氣體流量、溫度、真空、壓力、RF功率等的調節(jié)執(zhí)行；
支持外部信號輸入輸出、報警響應、故障診斷等功能。
二、應用領域分析
1. 蝕刻設備（Etch Systems）
控制腔體內的氣體比例、壓力控制、RF 功率輸出；
管理腔體門、提升機構、加熱板等子部件的動作邏輯；
與上位 MES 系統(tǒng)和設備主機（如 PLC 或工業(yè) PC）進行通信。
2. 化學氣相沉積設備（CVD / ALD）
實時控制沉積周期與薄膜厚度；
調節(jié) precursor 氣體通入量、溫度設定、真空狀態(tài)；
提供工藝穩(wěn)定性數(shù)據(jù)采集接口。
3. 清洗 / 顯影設備
管理清洗噴頭、水氣比例、電機運動、烘干等流程；
實現(xiàn)動作順序、時間設定與異常監(jiān)控。
英文資料：
The Tokyo Electron 3D80-000214-V4 controller module is an intelligent control component specifically designed for semiconductor manufacturing equipment, mainly used to implement internal process flow, subsystem management, and precision parameter control functions of the equipment. This module is one of the core control units in TEL (Tokyo Electron) high-end equipment platforms, such as etching, deposition, and other systems.
1、 Product functional positioning
Module Type: Process Controller/System Controller
Functional features:
Manage equipment operation logic, control instructions, and status monitoring;
Real time data exchange with the device control system;
Control the execution of subsystems such as gas flow rate, temperature, vacuum, pressure, RF power, etc;
Support functions such as external signal input and output, alarm response, and fault diagnosis.
2、 Application field analysis
Etch Systems etching equipment
Control the gas ratio, pressure control, and RF power output inside the chamber;
Manage the action logic of sub components such as cavity doors, lifting mechanisms, heating plates, etc;
Communicate with the upper MES system and equipment host (such as PLC or industrial PC).
2. Chemical vapor deposition equipment (CVD/ALD)
Real time control of sedimentation period and film thickness;
Adjust the precursor gas flow rate, temperature setting, and vacuum state;
Provide an interface for collecting process stability data.
3. Cleaning/developing equipment
Manage the processes of cleaning nozzles, water vapor ratio, motor movement, drying, etc;
Implement action sequence, time setting, and anomaly monitoring.
2.產 品 展 示
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