Tokyo Electron SBX08-000027-1超聲波器 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Tokyo Electron SBX08-000027-1 超聲波器（Ultrasonic Transducer / Cleaner Unit） 是一款用于半導(dǎo)體工藝中超聲波清洗或液體處理模塊的功能組件，常見(jiàn)于清洗、顯影、刻蝕前清潔或高精度材料表面處理等應(yīng)用場(chǎng)景。該部件通常集成于 TEL 的 清洗設(shè)備（Wet Station） 或 顯影機(jī)臺(tái)（Clean Track 系列） 中。
一、產(chǎn)品功能概述
設(shè)備類(lèi)型：超聲波器 / 超聲波清洗頭 / 超聲波換能器
主要功能：
通過(guò)超聲波振動(dòng)在液體中形成微小氣泡（空化效應(yīng)），去除附著在晶圓表面的微粒、污染物或殘膠；
實(shí)現(xiàn)無(wú)接觸式清洗，保障器件結(jié)構(gòu)的完整性與清潔度；
提高顯影或濕法刻蝕前的表面質(zhì)量控制。
二、主要應(yīng)用領(lǐng)域
1. 晶圓超聲清洗（Ultrasonic Wafer Cleaning）
用于去除晶圓表面的顆粒、金屬離子、微小污染物；
常與去離子水（DIW）、氫氟酸（HF）、臭氧水（SC1/SC2）等清洗液協(xié)同使用。
2. 光刻后顯影工藝
清除殘留的光刻膠、顯影液副產(chǎn)物；
提升圖形邊緣的整潔度，避免后續(xù)蝕刻缺陷。
3. 薄膜沉積后清洗
移除沉積殘?jiān)蚍乐刮廴疚锍练e在晶圓邊緣；
可用于前處理或中間處理步驟的清洗環(huán)節(jié)。
英文資料：
The Tokyo Electron SBX08-000027-1 Ultrasonic Transformer/Cleaner Unit is a functional component used for ultrasonic cleaning or liquid processing modules in semiconductor processes. It is commonly used in applications such as cleaning, development, pre etching cleaning, or high-precision material surface treatment. This component is usually integrated into TEL's Wet Station or Clean Track series of developing machines.
1、 Product Function Overview
Equipment type: Ultrasonic cleaner/Ultrasonic cleaning head/Ultrasonic transducer
Main functions:
By using ultrasonic vibration to form tiny bubbles (cavitation effect) in the liquid, particles, pollutants, or residual glue attached to the surface of the wafer can be removed;
Realize contactless cleaning to ensure the integrity and cleanliness of the device structure;
Improve surface quality control before development or wet etching.
2、 Main application areas
1. Ultrasonic Wafer Cleaning
Used to remove particles, metal ions, and small pollutants from the surface of wafers;
Often used in conjunction with cleaning solutions such as deionized water (DIW), hydrofluoric acid (HF), and ozone water (SC1/SC2).
2. Post lithography development process
Remove residual photoresist and developer by-products;
Improve the cleanliness of graphic edges to avoid subsequent etching defects.
3. Cleaning after film deposition
Remove sediment residue or prevent pollutants from depositing at the edge of the wafer;
Can be used in the cleaning process of pre-processing or intermediate processing steps.
2.產(chǎn) 品 展 示
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