Tokyo Electron AQA-K09-TYP2冷卻器組件 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Tokyo Electron AQA-K09-TYP2 冷卻器組件（Chiller Unit / Cooling Assembly） 是一款用于 TEL 半導(dǎo)體制造設(shè)備中的溫控系統(tǒng)關(guān)鍵部件，主要負(fù)責(zé)為工藝模塊（如反應(yīng)腔、光源、電子組件等）提供精準(zhǔn)的溫度調(diào)節(jié)和熱交換功能，以保障工藝穩(wěn)定性與設(shè)備安全運(yùn)行。
一、產(chǎn)品基本屬性
產(chǎn)品名稱：冷卻器組件（Chiller / Cooler Unit）
產(chǎn)品型號(hào)：AQA-K09-TYP2
制造商：Tokyo Electron Ltd.
模塊用途：液體或氣體溫度控制（可能為內(nèi)置或外接型冷卻模塊）
二、功能與作用
| 功能類別 | 具體說明 |
|---|---|
| 溫控管理 | 控制工藝模塊、電子系統(tǒng)或液體回路的溫度，使之維持在預(yù)設(shè)穩(wěn)定范圍 |
| 熱交換系統(tǒng) | 利用冷媒或 DIW（去離子水）等循環(huán)流體帶走熱量，實(shí)現(xiàn)連續(xù)冷卻 |
| 集成控制接口 | 與設(shè)備主控系統(tǒng)（如 PLC 或溫控控制器）連接，實(shí)現(xiàn)溫度反饋閉環(huán)控制 |
| 工藝保護(hù)功能 | 防止溫度漂移造成設(shè)備過熱、腔體膨脹、薄膜厚度不均或電氣元件損壞等問題 |
三、典型應(yīng)用領(lǐng)域
| 應(yīng)用模塊 | 冷卻用途 |
|---|---|
| 腔體冷卻 | 控制反應(yīng)腔體壁面溫度，避免粒子生成或反應(yīng)不均 |
| RF 模塊冷卻 | 保持射頻功率器件穩(wěn)定運(yùn)行，延長電源和匹配器壽命 |
| 化學(xué)液/顯影液冷卻系統(tǒng) | 穩(wěn)定液體溫度，控制化學(xué)反應(yīng)速率與晶圓表面處理一致性 |
| 激光/光源組件溫控系統(tǒng) | 降低光源發(fā)熱造成的波長漂移或光強(qiáng)波動(dòng)，提高圖形成像質(zhì)量 |
英文資料：
The Tokyo Electron AQA-K09-TYP2 Chiller Unit/Cooling Assembly is a key component of the temperature control system used in TEL semiconductor manufacturing equipment. It is mainly responsible for providing precise temperature regulation and heat exchange functions for process modules such as reaction chambers, light sources, electronic components, etc., to ensure process stability and safe equipment operation.
1、 Basic Product Attributes
Product Name: Chiller/Cooler Unit
Product model: AQA-K09-TYP2
Manufacturer: Tokyo Electron Ltd
Module purpose: Liquid or gas temperature control (may be an internal or external cooling module)
2、 Function and Function
Specific description of functional categories
Temperature control management controls the temperature of process modules, electronic systems, or liquid circuits to maintain it within a predetermined stable range
The heat exchange system utilizes circulating fluids such as refrigerant or DIW (deionized water) to remove heat and achieve continuous cooling
Connect the integrated control interface with the main control system of the equipment (such as PLC or temperature controller) to achieve temperature feedback closed-loop control
The process protection function prevents temperature drift from causing equipment overheating, cavity expansion, uneven film thickness, or damage to electrical components
3、 Typical application areas
Application module cooling purpose
Chamber cooling controls the temperature of the reaction chamber wall to avoid particle generation or uneven reaction
RF module cooling maintains stable operation of RF power devices, extending the lifespan of power supply and matching devices
Chemical/developer cooling system stabilizes liquid temperature, controls chemical reaction rate and ensures consistency with wafer surface treatment
The temperature control system of laser/light source components reduces wavelength drift or light intensity fluctuations caused by light source heating, and improves the quality of graphic imaging
2.產(chǎn) 品 展 示
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